Message from the Conference Chairman

On behalf of the Organizing Committee and the Indian Institute of Technology (IIT) Delhi, it is my pleasure to cordially invite you to participate in IMPLAST 2016, the 11th International Symposium on Plasticity and Impact Mechanics, being held in New Delhi, one of India’s most historic and culturally rich cities.

IMPLAST series began in 1973, seven of these have been held in India and three, the 7th, 9th and 10th Symposia, were held in Melbourne, Australia in 2000, Bochum, Germany in 2007, and Rhode Island, USA in 2010.

IMPLAST Symposia are attended by the scientists, engineers and researchers from the universities, scientific laboratories, and industries across the globe to share their latest research findings in fundamental and applied aspects of large deformation and failure of materials and structures resulting from quasi-static, earthquake, fire, impact or blast loading.

In addition to providing a platform for sharing the latest developments in plasticity and impact mechanics, these symposia have proven instrumental in building and strengthening lasting relationships between the participating scientists.

The weather in New Delhi in December is especially pleasant, and organizing committee will arrange for sightseeing and cultural events.

We look forward to welcoming you in New Delhi for attending the Symposium, and for the joy of meeting old friends and making new ones.

Narinder K. Gupta
Chairman, IMPLAST 2016

Publication of manuscripts

Manuscripts limited between 4 and 8 pages will be published online in Procedia Engineering (ELSEVIER).

Revised and expanded versions of the manuscripts will be considered for publication in special issues of reputed international journals such as International Journal of Impact Engineering, Thin-Walled Structures and some other reputed international journals, after their review process.

  • *Note: The author whose abstract has been accepted is required to pay the registration fee. One registration would cover publication of one manuscript.